Xpeedic to Exhibit at SMIC 2019 Technology Symposium

  • Time: September 19, 2019
  • Location: Shanghai

Xpeedic Technology will be exhibiting at the SMIC 2019 Technology Symposium Shanghai on Sept. 19. Featured as in-booth demos will include

  • A Complete EM Simulation Suite for On-Chip Passives in SMIC Advanced Nodes

As Moore's Law continues scaling and 5G moves to high frequencies including millimeter wave, EM simulation is required to be three dimensional and full-wave, accurate from DC to THz. IRIS is the state-of-the-art EM simulation technology tailored to advanced process nodes.

  • Integrated Passive Device Technology for RF Front End Design

IPD is a core technology to achieve highly integrated RF front-end modules. Utilizing high-resistance silicon and thick copper processes, IPD has both consistency and high integration of semiconductor process, and good RF performance similar to traditional thick film processes such as LTCC. With its unique IPD design methodology and flow, Xpeedic has developed a series of filters, duplexers, couplers, power dividers and other devices, which are ready to be used in antenna switch modules, power amplifier modules and other RF front-end modules.

  • IPD-enabled System-in-Package for Integrated System

SiP technology can integrate multiple chips of different processes (CMOS, SOI, GaAs, etc.) and different functions (digital, analog, RF, etc.) into one package, achieving the advantages of miniaturization, high performance and low cost. Xpeedic can integrate its unique IPD into SiP and achieve even higher integration. Thanks to its differentiating EDA tools, dedicated IPD/SiP design teams, wafer and packaging partners, the company is able to provide customers with one-stop SiP solutions and services.

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Xpeedic Secures Series-B Funding Led by SMIC Fortune-Tech Capital and Shanghai IOT Capital

Suzhou, China. – August 6, 2015 – Xpeedic, a leading provider of EDA, IPD, and SiP solution, today held a signing ceremony, to officially accept the joint investment from SMIC Fortune-Tech Capital and Shanghai IoT Capital.

“With high speed wireless telecommunication, especially 4G LTE network, continuing to evolve, the RF front end of mobile devices becomes more and more complicated, and poses tremendous challenges to IC designs. Compared to the discrete components, Xpeedic’s IPD technology has great advantages in miniaturization, high performance and low cost,” said Yuwang Sun, President of SMIC Fortune-Tech Capital, “In the last few years, Xpeedic has worked closely with SMIC and developed first-pass IPD design flow to enable quick IPD prototyping and volume product. We are very optimistic about Xpeedic’s growth in the next few years.”

Ms. Wang Xiaolei, the partner at Shanghai IoT Capital, said, “with the latest wave of IoT, we have seen many technology development in the space of smart devices in China market, however, most by those foreign companies. Xpeedic, with its home grown products in EDA and IPD, can deliver their solution with better performance and more importantly more tailored to Chinese customers.. We see a huge market ahead of us for Xpeedic.”

Mr. Yu Xiekang, the Vice Chairman of China Semiconductor Industry IC branch, said, “In the last few years, system miniaturization is a key challenge for semiconductor industry. Compared to SoC (System-on-Chip) solution, SiP provides a viable solution to enable integration of digital, analog, and RF blocks into one single package. We anticipate the wide adoption of Xpeedic’s SiP solution by the industry.”

Dr. Feng Ling, CEO of Xpeedic, said, “Xpeedic has made tremendous progress in developing industry leading EDA, IPD, and SiP solution since the start of the company in 2010. With this round of funding from the venture capitals with the resources in China’s semiconductor industry, we expect the even faster growth in the coming years.”

About Xpeedic
Xpeedic is a global leading provider of EDA software, IPD, and turn-key SiP design solution. The company is dedicated to help customers with high performance EDA tools and differentiating electronic design solution in the area of high speed digital designs, IC package designs, and RF analog mixed-signal designs. Their tools and solutions are widely adopted by the companies making smartphone, tablet, wearable devices and high speed data communication devices.
Founded in 2010, Xpeedic has offices in both US and China, Shanghai and Suzhou. For more information, please visit

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SMIC 2014 Technology Symposium in Shanghai

Date: Sept. 18, 2014.

Location: Shanghai

Xpeedic will be exhibiting at the SMIC 2014 Technology Symposium in Shanghai on Sept, 18, 2014. As a RF EDA and IP vendor, Xpeedic will showcase its flagship RFIC/TSV EDA tools, IPD(Integrated Passive Device) IP, and SiP package design services. Please visit us at Booth #08 to find out more.