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Xpeedic to Exhibit at SMIC 2019 Technology Symposium

  • Time: September 19, 2019
  • Location: Shanghai

Xpeedic Technology will be exhibiting at the SMIC 2019 Technology Symposium Shanghai on Sept. 19. Featured as in-booth demos will include

  • A Complete EM Simulation Suite for On-Chip Passives in SMIC Advanced Nodes

As Moore's Law continues scaling and 5G moves to high frequencies including millimeter wave, EM simulation is required to be three dimensional and full-wave, accurate from DC to THz. IRIS is the state-of-the-art EM simulation technology tailored to advanced process nodes.

  • Integrated Passive Device Technology for RF Front End Design

IPD is a core technology to achieve highly integrated RF front-end modules. Utilizing high-resistance silicon and thick copper processes, IPD has both consistency and high integration of semiconductor process, and good RF performance similar to traditional thick film processes such as LTCC. With its unique IPD design methodology and flow, Xpeedic has developed a series of filters, duplexers, couplers, power dividers and other devices, which are ready to be used in antenna switch modules, power amplifier modules and other RF front-end modules.

  • IPD-enabled System-in-Package for Integrated System

SiP technology can integrate multiple chips of different processes (CMOS, SOI, GaAs, etc.) and different functions (digital, analog, RF, etc.) into one package, achieving the advantages of miniaturization, high performance and low cost. Xpeedic can integrate its unique IPD into SiP and achieve even higher integration. Thanks to its differentiating EDA tools, dedicated IPD/SiP design teams, wafer and packaging partners, the company is able to provide customers with one-stop SiP solutions and services.

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Xpeedic to Exhibit at FD-SOI Forum and RF-SOI Workshop 2019

  • Date: September 16-17, 2019
  • Place: Shanghai, China

The 7th Shanghai FD-SOI Forum & 2019 International RF-SOI Workshop will be held in Shanghai at September 16-17, 2019.

The 7th Shanghai FD-SOI Forum

This 7th Shanghai FD-SOI Forum will focus on Automotive and IoT applications, products, and supply chain with AI/Edge Computing being discussed in conjunction with Automotive and IoT. There are keynote speeches by executives from Fabless and foundries. The theme of this year’s Forum is Deployment of FD-SOI, for which there are two sessions: AIoT using FD-SOI and automotive electronics using FD-SOI.

Visit here for FD-SOI event.

2019 International RF-SOI Workshop

The RF-SOI Workshop will be focused on 5G connectivity and its opportunity for SOI Industry. Keynote speaker will include 5G carrier, system provider and device maker. They will provide insight on the latest development on 5G deployment and RF-SOI readiness. In the afternoon session, there will be “China RF-SOI Ecosystem” and “RF Value Chain”. It will be focused on RF design and foundry platform for 5G RF-SOI application in China. Also worldwide SOI supply chain will be presented.

Visit here for RF-SOI event.

As an active member of SOI Industry Consortium, Xpeedic has been collaborating with members in the SOI eco-system to provide innovative EDA tools and IP solution to its customers. Xpeedic's passive modeling and simulation tool, IRIS, has been certified on FD-SOI process nodes including 22FDX from GlobalFoundries and 28FDS from Samsung Foundry. Xpeedic's IPD/SiP solution helps RF Front End (RFFE) design customers, where RF-SOI is the main technology player, to achieve high integration and system miniaturization.

In 2019 International RF-SOI Workshop, Dr. Feng Ling, CEO of Xpeedic Technology, will give a presentation titled “Innovative EDA Solutions to Enable Differentiated RF-SOI Designs” in the China RF-SOI Ecosystem session to showcase Xpeedic's contribution.

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Xpeedic Opens its Sillicon Valley Operation Center

Silicon Valley, US. — Feb 2, 2017 —Xpeedic Technology, Inc., a global leading provider of EDA software has announced to open its Silicon Valley operation center to best serve the needs of the customers and partners in north America market. The new operation center will deliver both the regional sales and technical support functions.

Founded in 2010, Xpeedic has long-established sales presence in China and offices in both US and China. Xpeedic is a global leading provider of EDA software, Integrated Passive Device (IPD), and System-in-Package (SiP) design solution. The analog/mixed-signal IC software tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The signal integrity software tools enable faster design closure for IC package and PCB system designs. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. All these tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.

This initiative is following customer-oriented company strategy, and will not only allow Xpeedic to be closer to customers in key markets, it will also provide the opportunity to work closer with strategic partners and keep Xpeedic with the latest advanced industry nodes.

About Xpeedic

Xpeedic Technology, Inc. is a global leading provider of EDA software, Integrated Passive Device (IPD), and System-in-Package (SiP) design solution. The analog/mixed-signal IC software tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The signal integrity software tools enable faster design closure for IC package and PCB system designs. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. These tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.

Founded in 2010, Xpeedic has offices in both US and China. For more information, please visit www.xpeedic.com.

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Xpeedic to Exhibit at EDI CON China 2016

Date: Apr 19-21, 2016.
Location: Beijing, China
Booth: 432

EDI CON brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. Unlike other shows with a separate more academic focused conference, EDI CON has industrial and technology leaders delivering most of the technical sessions, workshops and panels so that the exhibition is closely coupled with the conference. This makes the exhibition an extension of the technical conference where attendees can learn first-hand about products and services that offer practical solutions to their problems.

Xpeedic will showcase its integrated RFIC solution, including IPD (Integrated passive devices), EDA software, and SiP (System in package) service within the exhibition. Xpeedic’s silicon-based IPD technology, including standard IPD library for cellular and WiFi applications and turn-key customized IPD design, delivering industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Xpeedic’s EDA software tools enables fast electromagnetic modeling and extraction, which helps customers to achieve shorter time to market for their products.

More details to see http://ediconchina.com/default.asp

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DesignCon 2015

Date: Jan. 28-29, 2015.
Location: Santa Clara.

Xpeedic Technology, Inc. will exhibit at DesignCon 2015 at Santa Clara on Jan. 28-29, 2015.

Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.

Please visit Xpeedic at Booth #912 to find out more.

website: http://www.designcon.com/

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SMIC 2014 Technology Symposium in Shanghai

Date: Sept. 18, 2014.

Location: Shanghai

Xpeedic will be exhibiting at the SMIC 2014 Technology Symposium in Shanghai on Sept, 18, 2014. As a RF EDA and IP vendor, Xpeedic will showcase its flagship RFIC/TSV EDA tools, IPD(Integrated Passive Device) IP, and SiP package design services. Please visit us at Booth #08 to find out more.

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Xpeedic Announces Release of IRIS Platform Version 2014.01

Suzhou, China. -Jul. 30, 2014 -Xpeedic today releases three enhanced solutions (IRIS, iModeler and iVerifier) under IRIS platform version 2014.01 which will greatly accelerate RFIC passive extraction, PDK model generation and verification.  In the latest release of IRIS platform,  the mesh and solver technologies are further improved along with the new features such as auto HFSS project export and frequency and temperature dependent material support.

IRIS 2014.01 solution helps RFIC designers to quickly simulate the passives and interconnects of interest and then verify the design by automatically back-annotating the EM simulation to schematic. The solution greatly helps RFIC designers to reduce the design cycle and achieve first-pass silicon success.

iModeler 2014.01 solution accelerates the PDK model generation by built-in parameterized layout for passive devices and fast IRIS mesh and solver technologies.

iVerifier 2014.01 solution enables users to assess the PDK model quality by sweeping the parameters and evaluating the key metrics of the PDK elements.

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Xpeedic to Exhibit at DesignCon 2014

Xpeedic Technology, Inc. will exhibit at DesignCon 2014 at Santa Clara on Jan. 28-31, 2014. Xpeedic will showcase their EDA software and System-in-Package (SiP) design service in the conference.

Xpeedic will bring fast and accurate signal integrity software for IC-package-system designs. ViaExpert enables fast via modeling and simulation for both pre-layout and post-layout scenarios. SnpExpert provides quick way to view S-parameter and the associated TDR. Hermes tool provides signal and power integrity simulation for complex IC-package-board designs including thru-silicon-via (TSV).

Xpeedic’s SiP design service enables customers to achieve system miniaturization by integrating ICs from different process into one package. Their IP on silicon integrated passive devices (IPD) empowers further miniaturization by integrating the peripheral passives for a broad range of RF applications.

Please visit Xpeedic at Booth #755 to find out more.

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Xpeedic At IEEE EDAPS 2011

Suzhou, China — Nov. 28, 2011
 
Xpeedic Technology, Inc. will at IEEE EDAPS 2011, being held at Hangzhou, China on Dec. 12-14, 2011. Feng Ling, Founder/CEO of Xpeedic Technology, Inc. will organize a special workshop “EDA Solution for Chip, Package, and Board Designs”. Leading EDA vendors will present their solutions on various topics including TSV modeling, SI/PI simulation, co-simulation, and channel analysis. Dr. Wenliang Dai, VP of Engineering of Xpeedic Technology, Inc.,  will deliver the speech titled “Enabling Optimal Channel Performance by Interconnect Tuning”.