Date: Nov.21-22, 2019 Location: Nanjing, China Booth#: 045-046 Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2019 Annual Conference & Nanjing IC Industry Innovation and Development Summit (ICCAD 2019) in Nanjing on Nov.21-22, 2019. ICCAD is a most important annual event for IC design industry in China. It creates a biggest platform for enterprises within China IC industry chain […]
- Time: September 19, 2019
- Location: Shanghai
Xpeedic Technology will be exhibiting at the SMIC 2019 Technology Symposium Shanghai on Sept. 19. Featured as in-booth demos will include
- A Complete EM Simulation Suite for On-Chip Passives in SMIC Advanced Nodes
As Moore's Law continues scaling and 5G moves to high frequencies including millimeter wave, EM simulation is required to be three dimensional and full-wave, accurate from DC to THz. IRIS is the state-of-the-art EM simulation technology tailored to advanced process nodes.
- Integrated Passive Device Technology for RF Front End Design
IPD is a core technology to achieve highly integrated RF front-end modules. Utilizing high-resistance silicon and thick copper processes, IPD has both consistency and high integration of semiconductor process, and good RF performance similar to traditional thick film processes such as LTCC. With its unique IPD design methodology and flow, Xpeedic has developed a series of filters, duplexers, couplers, power dividers and other devices, which are ready to be used in antenna switch modules, power amplifier modules and other RF front-end modules.
- IPD-enabled System-in-Package for Integrated System
SiP technology can integrate multiple chips of different processes (CMOS, SOI, GaAs, etc.) and different functions (digital, analog, RF, etc.) into one package, achieving the advantages of miniaturization, high performance and low cost. Xpeedic can integrate its unique IPD into SiP and achieve even higher integration. Thanks to its differentiating EDA tools, dedicated IPD/SiP design teams, wafer and packaging partners, the company is able to provide customers with one-stop SiP solutions and services.
Date: Apr 19-21, 2016.
Location: Beijing, China
EDI CON brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. Unlike other shows with a separate more academic focused conference, EDI CON has industrial and technology leaders delivering most of the technical sessions, workshops and panels so that the exhibition is closely coupled with the conference. This makes the exhibition an extension of the technical conference where attendees can learn first-hand about products and services that offer practical solutions to their problems.
Xpeedic will showcase its integrated RFIC solution, including IPD (Integrated passive devices), EDA software, and SiP (System in package) service within the exhibition. Xpeedic’s silicon-based IPD technology, including standard IPD library for cellular and WiFi applications and turn-key customized IPD design, delivering industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Xpeedic’s EDA software tools enables fast electromagnetic modeling and extraction, which helps customers to achieve shorter time to market for their products.
More details to see http://ediconchina.com/default.asp
Suzhou, China. – August 6, 2015 – Xpeedic, a leading provider of EDA, IPD, and SiP solution, today held a signing ceremony, to officially accept the joint investment from SMIC Fortune-Tech Capital and Shanghai IoT Capital.
“With high speed wireless telecommunication, especially 4G LTE network, continuing to evolve, the RF front end of mobile devices becomes more and more complicated, and poses tremendous challenges to IC designs. Compared to the discrete components, Xpeedic’s IPD technology has great advantages in miniaturization, high performance and low cost,” said Yuwang Sun, President of SMIC Fortune-Tech Capital, “In the last few years, Xpeedic has worked closely with SMIC and developed first-pass IPD design flow to enable quick IPD prototyping and volume product. We are very optimistic about Xpeedic’s growth in the next few years.”
Ms. Wang Xiaolei, the partner at Shanghai IoT Capital, said, “with the latest wave of IoT, we have seen many technology development in the space of smart devices in China market, however, most by those foreign companies. Xpeedic, with its home grown products in EDA and IPD, can deliver their solution with better performance and more importantly more tailored to Chinese customers.. We see a huge market ahead of us for Xpeedic.”
Mr. Yu Xiekang, the Vice Chairman of China Semiconductor Industry IC branch, said, “In the last few years, system miniaturization is a key challenge for semiconductor industry. Compared to SoC (System-on-Chip) solution, SiP provides a viable solution to enable integration of digital, analog, and RF blocks into one single package. We anticipate the wide adoption of Xpeedic’s SiP solution by the industry.”
Dr. Feng Ling, CEO of Xpeedic, said, “Xpeedic has made tremendous progress in developing industry leading EDA, IPD, and SiP solution since the start of the company in 2010. With this round of funding from the venture capitals with the resources in China’s semiconductor industry, we expect the even faster growth in the coming years.”
Xpeedic is a global leading provider of EDA software, IPD, and turn-key SiP design solution. The company is dedicated to help customers with high performance EDA tools and differentiating electronic design solution in the area of high speed digital designs, IC package designs, and RF analog mixed-signal designs. Their tools and solutions are widely adopted by the companies making smartphone, tablet, wearable devices and high speed data communication devices.
Founded in 2010, Xpeedic has offices in both US and China, Shanghai and Suzhou. For more information, please visit www.xpeedic.cn.
Date:Dec. 11-12, 2014.
Location: Hong Kong
Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2014 Annual Conference at Hong Kong on Dec. 11-12, 2014.
At Dec 12, Dr.Wenliang Dai, Engineering VP, will present the leading design method-“RFSiP Miniaturization by Integrated Passive Devices(IPD)” with IC industry companion in ICCAD Subject Forum 3.
At booth 1F#21-22,Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.
Date: Sept. 18, 2014.
Xpeedic will be exhibiting at the SMIC 2014 Technology Symposium in Shanghai on Sept, 18, 2014. As a RF EDA and IP vendor, Xpeedic will showcase its flagship RFIC/TSV EDA tools, IPD(Integrated Passive Device) IP, and SiP package design services. Please visit us at Booth #08 to find out more.
Suzhou, China. -Jul. 30, 2014 -Xpeedic today releases three enhanced solutions (IRIS, iModeler and iVerifier) under IRIS platform version 2014.01 which will greatly accelerate RFIC passive extraction, PDK model generation and verification. In the latest release of IRIS platform, the mesh and solver technologies are further improved along with the new features such as auto HFSS project export and frequency and temperature dependent material support.
IRIS 2014.01 solution helps RFIC designers to quickly simulate the passives and interconnects of interest and then verify the design by automatically back-annotating the EM simulation to schematic. The solution greatly helps RFIC designers to reduce the design cycle and achieve first-pass silicon success.
iModeler 2014.01 solution accelerates the PDK model generation by built-in parameterized layout for passive devices and fast IRIS mesh and solver technologies.
iVerifier 2014.01 solution enables users to assess the PDK model quality by sweeping the parameters and evaluating the key metrics of the PDK elements.
Xpeedic Technology, Inc. will exhibit at ICCAD 2013 in Hefei, Anhui Province, China on Oct 10-11, 2013. Xpeedic will show their EDA software and IPD IP in the area of radio frequency integrated circuits, or RFICs. Their EDA software tools IRIS and iModeler, seamlessly integrated with Cadence Virtuoso, enables fast electromagnetic modeling and extraction for RFIC designs. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Please visit Xpeedic at Booth #25-26 to find out more.
Dr. Wenliang Dai, VP of Engineering of Xpeedic, will present the following paper in Subject Forum (II).
Paper: 3D IC Integration with TSV EDA, IPD Chip, and SiP Technology
Presenter: Wenliang Dai, PhD
When: 13:00-13:25, Friday, Oct. 11, 2013
Where: Floor 3, Room 2, Anhui Int’l Convention and Exhibition Center
Xpeedic will be exhibiting at the SMIC 2013 Technology Symposium in Shanghai on Sept, 04, 2013. As a RF EDA and IP vendor, Xpeedic will showcase its flagship RFIC/TSV EDA tools, IPD(Integrated Passive Device) IP, and SiP package design services. Please visit us at Booth #19 to find out more.
The 18th ICCAD 2012 will be held in Chongqing, China on December 6-7, 2012. The theme of this year is Development and Innovation, Executing Advantages, Optimization of Industrial Structure, and Creating a Leading Electronic Information Industry.
Dr. Wenliang Dai will have a technical presentation “Xpeedic RFIC and 3DIC Design & Simulation Platform” in IP and IC Design Session at 17:00-17:30 on Dec 7, Friday, 2012.
Please visit Xpeedic in booth B01-02 at the second floor at Chongqing International Conference & Exhibition Center on December 6-7, 2012. More detail…