Date: Nov.21-22, 2019 Location: Nanjing, China Booth#: 045-046 Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2019 Annual Conference & Nanjing IC Industry Innovation and Development Summit (ICCAD 2019) in Nanjing on Nov.21-22, 2019. ICCAD is a most important annual event for IC design industry in China. It creates a biggest platform for enterprises within China IC industry chain […]
- Date: September 16-17, 2019
- Place: Shanghai, China
The 7th Shanghai FD-SOI Forum & 2019 International RF-SOI Workshop will be held in Shanghai at September 16-17, 2019.
The 7th Shanghai FD-SOI Forum
This 7th Shanghai FD-SOI Forum will focus on Automotive and IoT applications, products, and supply chain with AI/Edge Computing being discussed in conjunction with Automotive and IoT. There are keynote speeches by executives from Fabless and foundries. The theme of this year’s Forum is Deployment of FD-SOI, for which there are two sessions: AIoT using FD-SOI and automotive electronics using FD-SOI.
Visit here for FD-SOI event.
2019 International RF-SOI Workshop
The RF-SOI Workshop will be focused on 5G connectivity and its opportunity for SOI Industry. Keynote speaker will include 5G carrier, system provider and device maker. They will provide insight on the latest development on 5G deployment and RF-SOI readiness. In the afternoon session, there will be “China RF-SOI Ecosystem” and “RF Value Chain”. It will be focused on RF design and foundry platform for 5G RF-SOI application in China. Also worldwide SOI supply chain will be presented.
Visit here for RF-SOI event.
As an active member of SOI Industry Consortium, Xpeedic has been collaborating with members in the SOI eco-system to provide innovative EDA tools and IP solution to its customers. Xpeedic's passive modeling and simulation tool, IRIS, has been certified on FD-SOI process nodes including 22FDX from GlobalFoundries and 28FDS from Samsung Foundry. Xpeedic's IPD/SiP solution helps RF Front End (RFFE) design customers, where RF-SOI is the main technology player, to achieve high integration and system miniaturization.
In 2019 International RF-SOI Workshop, Dr. Feng Ling, CEO of Xpeedic Technology, will give a presentation titled “Innovative EDA Solutions to Enable Differentiated RF-SOI Designs” in the China RF-SOI Ecosystem session to showcase Xpeedic's contribution.
Silicon Valley, US. — Feb 2, 2017 —Xpeedic Technology, Inc., a global leading provider of EDA software has announced to open its Silicon Valley operation center to best serve the needs of the customers and partners in north America market. The new operation center will deliver both the regional sales and technical support functions.
Founded in 2010, Xpeedic has long-established sales presence in China and offices in both US and China. Xpeedic is a global leading provider of EDA software, Integrated Passive Device (IPD), and System-in-Package (SiP) design solution. The analog/mixed-signal IC software tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The signal integrity software tools enable faster design closure for IC package and PCB system designs. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. All these tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.
This initiative is following customer-oriented company strategy, and will not only allow Xpeedic to be closer to customers in key markets, it will also provide the opportunity to work closer with strategic partners and keep Xpeedic with the latest advanced industry nodes.
Xpeedic Technology, Inc. is a global leading provider of EDA software, Integrated Passive Device (IPD), and System-in-Package (SiP) design solution. The analog/mixed-signal IC software tools help IC engineers to shorten their design cycle at the latest advanced semiconductor nodes. The signal integrity software tools enable faster design closure for IC package and PCB system designs. The growing IP portfolio on IPD delivers the industry-leading combination of performance and integration to enable SiP for RF front end module designs. These tools and solutions have been widely adopted by companies who make mobile and IoT devices, computing and network systems.
Founded in 2010, Xpeedic has offices in both US and China. For more information, please visit www.xpeedic.com.
Data: Friday, Nov.11, 2016 in Shanghai/ Monday, Nov.14,2016 in Taipei
Location: Parkyard Hotel Shanghai, 699 Bibo Road, Zhangjiang Hi-Tech Park, Shanghai/ The Sherwood Hotel, No.111, Sec.3, Min Sheng East Road, Taipei
Xpeedic Technology will participate the Asian IBIS Summit Shanghai and Taipei on Nov. 11 and Nov.14, 2016. Dr. Wenliang Dai, VP of Engineering and Zachary Su, AE manager of Xpeedic Technology will deliver the following speech:
Paper: Multiple Channel Analysis for Orthogonal Backplane Design
Authors: Dr. Wenliang Dai and Zachary Su
More details to see: http://www.eda.org/ibis/summits/
Signal integrity in high speed digital design Seminar will be jointly organized by Xpeedic Technology, Taiwan Electronic Connection Industry Association and Polar Instruments on Nov.3, 2016.
This seminar will introduce the main challenges of signal integrity in high speed design and the practical solutions. CEO of Xpeedic and his team will deliver a comprehensive presentation and SI experts from Lenovo, Keystone and Advantech will also share their success cases then.
Please join us by registration in Taiwan@polarinstruments.asia.
- Time：Thursday 2016/11/3 9:00-16:30
- Place：Novotel Taipei Taoyuan International Airport
Date: Apr 19-21, 2016.
Location: Beijing, China
EDI CON brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. Unlike other shows with a separate more academic focused conference, EDI CON has industrial and technology leaders delivering most of the technical sessions, workshops and panels so that the exhibition is closely coupled with the conference. This makes the exhibition an extension of the technical conference where attendees can learn first-hand about products and services that offer practical solutions to their problems.
Xpeedic will showcase its integrated RFIC solution, including IPD (Integrated passive devices), EDA software, and SiP (System in package) service within the exhibition. Xpeedic’s silicon-based IPD technology, including standard IPD library for cellular and WiFi applications and turn-key customized IPD design, delivering industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Xpeedic’s EDA software tools enables fast electromagnetic modeling and extraction, which helps customers to achieve shorter time to market for their products.
More details to see http://ediconchina.com/default.asp
Shanghai, China. – December 24, 2015 – Xpeedic, a leading provider of EDA, IPD and SiP solution, today announced the partnership with Shanghai ICC (IC Industry Promotion Center).Xpeedic’s EDA flagship tools in high speed digital and RF IC designs are now part of ICC’s EDA service platform.
In order to promote the development of the IC design industry and to create a low-cost, low-risk design environment for the majority of design firms, ICC Shanghai has established an EDA software and hardware platform, providing SMEs with advanced software, hardware design verification environment, strict data security and sound technical support.
“On our platform, currently we only accommodate the software vendors with industry-proven and widely-adopted EDA solution such as the top three –Synopsys, Cadence and Mentor Graphics. The platform carefully selected two domestic EDA leaders and Xpeedic is one of them. It is for sure that cooperating with these EDA software companies, we will help more SMEs to adopt the world-leading solutions, ” said the leader at the ICC EDA platform.
“Rapidly growing data demand has driven the growth of mobile broadband, wifi, IoT, and cloud computing, fueling the development of network, devices, and applications. High speed communication link and RF front end designs, which directly contributes to the bandwidth of the data transmission, becomes more and more challenging because of the ever increasing data rate and frequency band allocation,” . said Dr. Ling, CEO of Xpeedic. ”Xpeedic's RF IC and high speed SI solution provide a fast and accurate way to enable engineers to design with confidence, shorten the design cycle, and thus reduce the time to market. . With this partnership with ICC, we expect to help more domestic SMEs with the best tools and design the next generation electronic devices.
Xpeedic EDA modules included in ICC EDA platform are IRIS for RFIC passive extraction , SnpExpert for S-parameter exploration, ViaExpert for 3D Via Modeling and Simulation, and ChannelExpert for high speed channel exploration.
Xpeedic Technology, Inc. will host an EDA seminar in Taipei, Taiwan on Oct.12, 2015.
High speed communication link design becomes more and more challenging because of the ever increasing data rate and the rapid development of semiconductor and IC technology. At multi-gigabit per second data rate, designers must characterize all the pieces in the signal path from transmit to receiver to address the signal integrity issues, including reflections, crosstalk, Simultaneous Switching Noise (SSN) and so on. Even a small discontinuity can significantly degrade the signal.
This seminar is targeting the SI engineers and to discuss fast and accurate way to model and simulate discontinuities along the path and optimize the channel performance. Xpeedic’s co-founder CEO Dr.Ling and VP engineering Dr. Dai will present within the seminar.
9:30-9:40 Welcome and Overview
9:40-10:10 S-parameter in high speed SI
10:10-10:40 Via modeling and optimization
10:40-11:00 Coffee/tea break
11:00-11:30 Impedance discontinuities from surface mounted pads
11:30-12:00 High speed channel modeling and optimization
12:00-13:00 Luck draw and Lunch
Venue: Conference center of National Taipei University of Technology
If you have interest, please send email to Marketing@xpeedic.com for registration.
Date:Oct 25-28, 2015.
Location: San Jose, CA
Xpeedic to Exhibit at EPEPS 2015
EPEPS (Electrical Performance of Electronic Packaging and Systems) is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs.
Xpeedic will showcase its latest technology on EDA software, IPD and SiP solution. Xpeedic EDA software tools enables fast electromagnetic modeling and extraction. The IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.
More details to see http://www.epeps.org/
Suzhou, China. – August 6, 2015 – Xpeedic, a leading provider of EDA, IPD, and SiP solution, today held a signing ceremony, to officially accept the joint investment from SMIC Fortune-Tech Capital and Shanghai IoT Capital.
“With high speed wireless telecommunication, especially 4G LTE network, continuing to evolve, the RF front end of mobile devices becomes more and more complicated, and poses tremendous challenges to IC designs. Compared to the discrete components, Xpeedic’s IPD technology has great advantages in miniaturization, high performance and low cost,” said Yuwang Sun, President of SMIC Fortune-Tech Capital, “In the last few years, Xpeedic has worked closely with SMIC and developed first-pass IPD design flow to enable quick IPD prototyping and volume product. We are very optimistic about Xpeedic’s growth in the next few years.”
Ms. Wang Xiaolei, the partner at Shanghai IoT Capital, said, “with the latest wave of IoT, we have seen many technology development in the space of smart devices in China market, however, most by those foreign companies. Xpeedic, with its home grown products in EDA and IPD, can deliver their solution with better performance and more importantly more tailored to Chinese customers.. We see a huge market ahead of us for Xpeedic.”
Mr. Yu Xiekang, the Vice Chairman of China Semiconductor Industry IC branch, said, “In the last few years, system miniaturization is a key challenge for semiconductor industry. Compared to SoC (System-on-Chip) solution, SiP provides a viable solution to enable integration of digital, analog, and RF blocks into one single package. We anticipate the wide adoption of Xpeedic’s SiP solution by the industry.”
Dr. Feng Ling, CEO of Xpeedic, said, “Xpeedic has made tremendous progress in developing industry leading EDA, IPD, and SiP solution since the start of the company in 2010. With this round of funding from the venture capitals with the resources in China’s semiconductor industry, we expect the even faster growth in the coming years.”
Xpeedic is a global leading provider of EDA software, IPD, and turn-key SiP design solution. The company is dedicated to help customers with high performance EDA tools and differentiating electronic design solution in the area of high speed digital designs, IC package designs, and RF analog mixed-signal designs. Their tools and solutions are widely adopted by the companies making smartphone, tablet, wearable devices and high speed data communication devices.
Founded in 2010, Xpeedic has offices in both US and China, Shanghai and Suzhou. For more information, please visit www.xpeedic.cn.