Date: Nov.21-22, 2019 Location: Nanjing, China Booth#: 045-046 Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2019 Annual Conference & Nanjing IC Industry Innovation and Development Summit (ICCAD 2019) in Nanjing on Nov.21-22, 2019. ICCAD is a most important annual event for IC design industry in China. It creates a biggest platform for enterprises within China IC industry chain […]
- Time: September 19, 2019
- Location: Shanghai
Xpeedic Technology will be exhibiting at the SMIC 2019 Technology Symposium Shanghai on Sept. 19. Featured as in-booth demos will include
- A Complete EM Simulation Suite for On-Chip Passives in SMIC Advanced Nodes
As Moore's Law continues scaling and 5G moves to high frequencies including millimeter wave, EM simulation is required to be three dimensional and full-wave, accurate from DC to THz. IRIS is the state-of-the-art EM simulation technology tailored to advanced process nodes.
- Integrated Passive Device Technology for RF Front End Design
IPD is a core technology to achieve highly integrated RF front-end modules. Utilizing high-resistance silicon and thick copper processes, IPD has both consistency and high integration of semiconductor process, and good RF performance similar to traditional thick film processes such as LTCC. With its unique IPD design methodology and flow, Xpeedic has developed a series of filters, duplexers, couplers, power dividers and other devices, which are ready to be used in antenna switch modules, power amplifier modules and other RF front-end modules.
- IPD-enabled System-in-Package for Integrated System
SiP technology can integrate multiple chips of different processes (CMOS, SOI, GaAs, etc.) and different functions (digital, analog, RF, etc.) into one package, achieving the advantages of miniaturization, high performance and low cost. Xpeedic can integrate its unique IPD into SiP and achieve even higher integration. Thanks to its differentiating EDA tools, dedicated IPD/SiP design teams, wafer and packaging partners, the company is able to provide customers with one-stop SiP solutions and services.
- Date: September 16-17, 2019
- Place: Shanghai, China
The 7th Shanghai FD-SOI Forum & 2019 International RF-SOI Workshop will be held in Shanghai at September 16-17, 2019.
The 7th Shanghai FD-SOI Forum
This 7th Shanghai FD-SOI Forum will focus on Automotive and IoT applications, products, and supply chain with AI/Edge Computing being discussed in conjunction with Automotive and IoT. There are keynote speeches by executives from Fabless and foundries. The theme of this year’s Forum is Deployment of FD-SOI, for which there are two sessions: AIoT using FD-SOI and automotive electronics using FD-SOI.
Visit here for FD-SOI event.
2019 International RF-SOI Workshop
The RF-SOI Workshop will be focused on 5G connectivity and its opportunity for SOI Industry. Keynote speaker will include 5G carrier, system provider and device maker. They will provide insight on the latest development on 5G deployment and RF-SOI readiness. In the afternoon session, there will be “China RF-SOI Ecosystem” and “RF Value Chain”. It will be focused on RF design and foundry platform for 5G RF-SOI application in China. Also worldwide SOI supply chain will be presented.
Visit here for RF-SOI event.
As an active member of SOI Industry Consortium, Xpeedic has been collaborating with members in the SOI eco-system to provide innovative EDA tools and IP solution to its customers. Xpeedic's passive modeling and simulation tool, IRIS, has been certified on FD-SOI process nodes including 22FDX from GlobalFoundries and 28FDS from Samsung Foundry. Xpeedic's IPD/SiP solution helps RF Front End (RFFE) design customers, where RF-SOI is the main technology player, to achieve high integration and system miniaturization.
In 2019 International RF-SOI Workshop, Dr. Feng Ling, CEO of Xpeedic Technology, will give a presentation titled “Innovative EDA Solutions to Enable Differentiated RF-SOI Designs” in the China RF-SOI Ecosystem session to showcase Xpeedic's contribution.