Date: Nov.21-22, 2019 Location: Nanjing, China Booth#: 045-046 Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2019 Annual Conference & Nanjing IC Industry Innovation and Development Summit (ICCAD 2019) in Nanjing on Nov.21-22, 2019. ICCAD is a most important annual event for IC design industry in China. It creates a biggest platform for enterprises within China IC industry chain […]
Date: Apr 19-21, 2016.
Location: Beijing, China
EDI CON brings together leading RF, microwave, high-speed analog and mixed signal components, semiconductor, test and measurement equipment, materials and packaging, EDA/CAD and system solution providers in the exhibition. Unlike other shows with a separate more academic focused conference, EDI CON has industrial and technology leaders delivering most of the technical sessions, workshops and panels so that the exhibition is closely coupled with the conference. This makes the exhibition an extension of the technical conference where attendees can learn first-hand about products and services that offer practical solutions to their problems.
Xpeedic will showcase its integrated RFIC solution, including IPD (Integrated passive devices), EDA software, and SiP (System in package) service within the exhibition. Xpeedic’s silicon-based IPD technology, including standard IPD library for cellular and WiFi applications and turn-key customized IPD design, delivering industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Xpeedic’s EDA software tools enables fast electromagnetic modeling and extraction, which helps customers to achieve shorter time to market for their products.
More details to see http://ediconchina.com/default.asp
Suzhou, China. – August 6, 2015 – Xpeedic, a leading provider of EDA, IPD, and SiP solution, today held a signing ceremony, to officially accept the joint investment from SMIC Fortune-Tech Capital and Shanghai IoT Capital.
“With high speed wireless telecommunication, especially 4G LTE network, continuing to evolve, the RF front end of mobile devices becomes more and more complicated, and poses tremendous challenges to IC designs. Compared to the discrete components, Xpeedic’s IPD technology has great advantages in miniaturization, high performance and low cost,” said Yuwang Sun, President of SMIC Fortune-Tech Capital, “In the last few years, Xpeedic has worked closely with SMIC and developed first-pass IPD design flow to enable quick IPD prototyping and volume product. We are very optimistic about Xpeedic’s growth in the next few years.”
Ms. Wang Xiaolei, the partner at Shanghai IoT Capital, said, “with the latest wave of IoT, we have seen many technology development in the space of smart devices in China market, however, most by those foreign companies. Xpeedic, with its home grown products in EDA and IPD, can deliver their solution with better performance and more importantly more tailored to Chinese customers.. We see a huge market ahead of us for Xpeedic.”
Mr. Yu Xiekang, the Vice Chairman of China Semiconductor Industry IC branch, said, “In the last few years, system miniaturization is a key challenge for semiconductor industry. Compared to SoC (System-on-Chip) solution, SiP provides a viable solution to enable integration of digital, analog, and RF blocks into one single package. We anticipate the wide adoption of Xpeedic’s SiP solution by the industry.”
Dr. Feng Ling, CEO of Xpeedic, said, “Xpeedic has made tremendous progress in developing industry leading EDA, IPD, and SiP solution since the start of the company in 2010. With this round of funding from the venture capitals with the resources in China’s semiconductor industry, we expect the even faster growth in the coming years.”
Xpeedic is a global leading provider of EDA software, IPD, and turn-key SiP design solution. The company is dedicated to help customers with high performance EDA tools and differentiating electronic design solution in the area of high speed digital designs, IC package designs, and RF analog mixed-signal designs. Their tools and solutions are widely adopted by the companies making smartphone, tablet, wearable devices and high speed data communication devices.
Founded in 2010, Xpeedic has offices in both US and China, Shanghai and Suzhou. For more information, please visit www.xpeedic.cn.
Date:Dec. 11-12, 2014.
Location: Hong Kong
Xpeedic Technology, Inc. will exhibit at CSIA-ICCAD 2014 Annual Conference at Hong Kong on Dec. 11-12, 2014.
At Dec 12, Dr.Wenliang Dai, Engineering VP, will present the leading design method-“RFSiP Miniaturization by Integrated Passive Devices(IPD)” with IC industry companion in ICCAD Subject Forum 3.
At booth 1F#21-22,Xpeedic will showcase their high speed signal integrity (SI) solution and RF front end miniaturization solution in the conference. Their fast and accurate SI software enables the quick way to simulate the high speed channel for both pre-layout and post-layout scenarios.Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications.
Xpeedic Technology, Inc. will exhibit at ICCAD 2013 in Hefei, Anhui Province, China on Oct 10-11, 2013. Xpeedic will show their EDA software and IPD IP in the area of radio frequency integrated circuits, or RFICs. Their EDA software tools IRIS and iModeler, seamlessly integrated with Cadence Virtuoso, enables fast electromagnetic modeling and extraction for RFIC designs. Their IP on silicon integrated passive devices (IPD) delivers the industry-leading combination of performance and integration to enable system-in-package (SiP) for a broad range of applications. Please visit Xpeedic at Booth #25-26 to find out more.
Dr. Wenliang Dai, VP of Engineering of Xpeedic, will present the following paper in Subject Forum (II).
Paper: 3D IC Integration with TSV EDA, IPD Chip, and SiP Technology
Presenter: Wenliang Dai, PhD
When: 13:00-13:25, Friday, Oct. 11, 2013
Where: Floor 3, Room 2, Anhui Int’l Convention and Exhibition Center
The 18th ICCAD 2012 will be held in Chongqing, China on December 6-7, 2012. The theme of this year is Development and Innovation, Executing Advantages, Optimization of Industrial Structure, and Creating a Leading Electronic Information Industry.
Dr. Wenliang Dai will have a technical presentation “Xpeedic RFIC and 3DIC Design & Simulation Platform” in IP and IC Design Session at 17:00-17:30 on Dec 7, Friday, 2012.
Please visit Xpeedic in booth B01-02 at the second floor at Chongqing International Conference & Exhibition Center on December 6-7, 2012. More detail…
Xpeedic will participate in ICMMT2012 May 5 – 8 in Shenzhen, China. Xpeedic will have exhibition at booth B30 – B32. Xpeedic will make speech and draw lucky visitors at 15:40 pm, May 6. more…
Xpeedic Speech Title: Fast 3D electromagnetic simulation tool based on the Cadence Virtuoso– IRIS
Abstract: IRIS provides RFIC designers a EM simulation tool based on Cadence Virtuoso software environment. It uses full-wave 3D fast method of moments to improve the simulation speed and the efficiency of IC design. Being perfect compatibility with Cadence Virtuoso, IRIS’s optimization of the mesh function can combine the simulation accuracy and speed. The function of back annotation realizes the perfect convergence of RFIC design from front-end to back-end and return to the front-end. At the same time, IRIS supports distributed and multi-thread parallel computing.
Suzhou, China — Nov. 11, 2011
Xpeedic will be exhibiting at 2011 CSIA-ICCAD Annual Conference & China IC Design Industry 10-Year Achievements Exhibition, being held at Xi’an Greenland Pico Int’l Convention & Exhibition Center on Nov. 17-18, 2011.
Suzhou, China — Nov. 11, 2011
Xpeedic Technology, Inc. will present at Asian IBIS Summit being held at Shanghai on Nov. 15, 2011. Dr. Wenliang Dai, VP of Engineering of Xpeedic Technology, Inc., delivers the following speech
Paper: IBIS Model as De-Facto Standard
Authors: Kazuhiko Kusunoki, Wadow Co., Ltd.
Wenliang Dai, Xpeedic Technology, Inc.
When: 9:15 – 9:40 AM, Tuesday, Nov. 15, 2011
Where: Parkyard Hotel Shanghai, 699 Bibo Road, Zhangjiang Hi-Tech Park, Shanghai 201203, P.R. China
Portland, Oregon – July 6, 2011
Xpeedic Technology presents a technical paper at the international conference InterPACK 2011 (http://www.asmeconferences.org/InterPACK2011/) being held July 6-8 in Portland, Oregon. Dr. Feng Ling, CEO of Xpeedic Technology, Inc., presents the paper co-authored by Xpeedic Technology, Inc. and Jiangsu Changjiang Electronics Technology Co., Ltd.
Paper: Signal Integrity Analysis for RF System-in-Package Designs
Authors: Feng Ling, Xpeedic Technology, Inc.
Jeff Chen, Jiangsu Changjiang Electronics Technology Co., Ltd
Weiping Li, Jiangsu Changjiang Electronics Technology Co., Ltd
Session: 8-2 Electrical Analysis of Microelectronic Packages – II
When: 2:15 – 3:30 PM, Wednesday, July 6, 2011
Where: Marriott Portland Downtown Waterfront 1401 SW Naito Parkway Portland, OR 97201
The InterPACK conference is the flagship technical meeting of the ASME Electronic and Photonic Packaging Division (EPPD), with the participation of JSME, IEEE-CPMT, and iNEMI.