Santa Clara, California, Jan 26, 2015
Xpeedic Technology, Inc.(Xpeedic), a global supplier of EDA and IP solution in RF and high speed market, today announced that H3C, a leading IT infrastructure solution provider, has adopted its SI solution including SnpExpert and ViaExpert for their high speed designs. SnpExpert provides a quick way to assess the S-parameter model for connectors, packages, and systems. ViaExpert can create via models with order of magnitude faster than the traditional 3D full-wave solver with the aid of its proprietary 3D hybrid solver technology. These tools will be showcased in Xpeedic’s booth (#912) at this year’s DesignCon in Santa Clara, Calif., Jan 27-30, 2015.
“As the date rate continues to increase, high speed channel designs need accurately characterize every piece along the signal path. We need a more automated flow with ease of use while being accurate.” said Mingan Xiang, Manager for Interconnect Design Department at H3C. “Xpeedic’s EDA tools are tailored to our design needs. With their built-in productivity enhanced features, our SI engineers are able to perform their job more efficiently.”
“We are excited to see that the market leader like H3C adopts Xpeedic’s high speed SI solution.” said Dr. Feng Ling, CEO of Xpeedic. “With the increasing demand for more automated design flow, customers feel that the traditional SI tools could not meet their goal in terms of efficiency and productivity. For that reason, we have developed a suite of SI tools with a lot of built-in templates for the ease of use in addition to the proprietary fast electromagnetic technologies.”
Xpeedic provides EDA software, IP, and turn-key design solution to enable today’s innovation in RF and high speed digital designs. More information about the company, its products, and services is available at http://www.xpeedic.cn.