HERMES SI – Package and Board level signal integrity analysis

Background

Impedance discontinuity in the signal path has a significant impact on signal integrity for high speed channel design. Among the many discontinuities, via discontinuity plays an important role in the high speed channel design. Three-dimensional full-wave EM simulation is constantly used to analyze via discontinuity, but there are many defects in the traditional 3D full-wave simulation, for example, the model creation is complex and time-consuming.

Product Introduction

HERMES SI is an application which use three-dimensional full-wave EM simulation to deal with high-speed serial circuit. It provides a fast and accurate import brd models, check the signal integrity metrics such as insertion loss, return loss, and crosstalk; it also allows designer to perform simulation and track processing for the post-layout model.
HERMES SI supports following main features:

  • Optimized mesh algorithm improves simulation speed and precision
  • Fast 3D FEM solver provides high-precision, high-quality solution
  • Hybrid solver provides high-speed solution, performance is higher than similar products in market
  • Support import brd model
  • Manually add port, analysis setting
  • The 3D view function makes the model checking more easily and visually
  • Support export result to HFSS and CTS
Highlights
  • Built-in full wave FEM3D solver and Hybrid solver.

  • Automatic port generation simplifies EM analysis setup.

  • Seamlessly link to SnpExpert for S-parameter viewing and post-processing.

Main Features
  • The FEM3D solver provides high-precision, high-quality simulation results. While the Hybrid solver focuses on simulation speed and provides a solution for rapid analysis
  • Optimization mesh improves the simulation accuracy and speed
  • Support PCB and package Co-simulation
  • Support to create and edit Bondwire, Solder ball
  • Support material library and padstack library management
  • Support the latest tabbed routing template for quick modeling
  • Support to import ODB++ , IPC-2581, Allegro brd\mcm\sip, PADS ASC file
  • 3D-View makes the model check easier
  • Add a recent project management panel to achieve a quick preview of recent projects
  • Support to quickly edit trace and padstack
  • Support cutting a smaller rectangler or polygonal area by for analysis , reducing simulation scale
  • Support export models to third-party tools, such as HFSS or CST
Resource Center
Hermes_DataSheet_CN.pdf
Hermes_DataSheet_EN.pdf
Hermes_Release_Notes.pdf