HERMES SI – Package and Board level signal integrity analysis

Background
Impedance discontinuity in the signal path has a significant impact on signal integrity for high speed channel design. Among the many discontinuities, via discontinuity plays an important role in the high speed channel design. Three-dimensional full-wave EM simulation is constantly used to analyze via discontinuity, but there are many defects in the traditional 3D full-wave simulation, for example, the model creation is complex and time-consuming.
Product Introduction
HERMES SI is an application which use three-dimensional full-wave EM simulation to deal with high-speed serial circuit. It provides a fast and accurate import brd models, check the signal integrity metrics such as insertion loss, return loss, and crosstalk; it also allows designer to perform simulation and track processing for the post-layout model.
HERMES SI supports following main features:
- Optimized mesh algorithm improves simulation speed and precision
- Fast 3D FEM solver provides high-precision, high-quality solution
- Hybrid solver provides high-speed solution, performance is higher than similar products in market
- Support import brd model
- Manually add port, analysis setting
- The 3D view function makes the model checking more easily and visually
- Support export result to HFSS and CTS
Highlights

- Built-in full wave FEM3D solver and Hybrid solver.

- Automatic port generation simplifies EM analysis setup.

- Seamlessly link to SnpExpert for S-parameter viewing and post-processing.
Main Features
- The FEM3D solver provides high-precision, high-quality simulation results. While the Hybrid solver focuses on simulation speed and provides a solution for rapid analysis
- Optimization mesh improves the simulation accuracy and speed
- Support PCB and package Co-simulation
- Support to create and edit Bondwire, Solder ball
- Support material library and padstack library management
- Support the latest tabbed routing template for quick modeling
- Support to import ODB++ , IPC-2581, Allegro brd\mcm\sip, PADS ASC file
- 3D-View makes the model check easier
- Add a recent project management panel to achieve a quick preview of recent projects
- Support to quickly edit trace and padstack
- Support cutting a smaller rectangler or polygonal area by for analysis , reducing simulation scale
- Support export models to third-party tools, such as HFSS or CST