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Heracles – Automated SI Signoff for High Speed Design
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HERMES SI – Package and Board level signal integrity analysis
Metis – Fast Package and IC Co-simulation
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XDS – Xpeedic RF System Design and Simulation Platform
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Xpeedic to Exhibit at GTC 2020 - North America
SiP Webinar: 5G RF IC Package Design Solutions
Xpeedic to Exhibit at WSCE2020
Xpeedic to Exhibit at CadenceLIVE2020 Americas
Xpeedic to Exhibit at IMS2020
(中文) Xpeedic EDA网络发布会——高速系统仿真解决方案
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