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EPEPS 2020

Date: Oct 5-7, 2020
Virtual Event

EPEPS (Electrical Performance of Electronic Packaging and Systems) is the premier international conference on advanced and emerging issues in electrical modeling, analysis and design of electronic interconnections, packages and systems. It also focuses on new methodologies and design techniques for evaluating and ensuring signal, power and thermal integrity in high-speed designs.

Xpeedic will showcase its latest update in 5G solution and high speed signal integrity (SI) solution in the conference. Xpeedic 5G solution enables designers inSoC, RFIC, packaging, board to build better 5G systems with theirdifferentiating technologies. It includes the following highlights:

IC Category

On-chip passive modeling and simulation for RF and high performance analog designs for mobile, connectivity and optical applications
  • RFIC Passive Simulation
  • Analog/Mix Signal IC Passive Simulation
  • RF PDK Turn Key Solution

Package Category

Package modeling and simulation ranging from low cost packages to high performance interposer with TSV for mobile, networking and server applications

  • RFFE Module Simulation
  • Advanced Package Simulation
  • System in Package Simulation

System Category

Package and board level Signal Integrity analysis for high speed digital system designs in servers, storage and networking

  • RF PCB System Simulation
  • High Speed Digital System Simulation

More details to see http://www.epeps.org/