Date: Aug 4-6, 2020
A Virtual Experience ( Click here to enter Xpeedic Virtual Booth)
Xpeedic will showcase its latest 5G RF solution at the 2020 IEEE MTT-S International Microwave Symposium (IMS) .
Xpeedic RF solution spans from IC, filter, to package. Its on-chip passive modeling and simulation tool IRIS, certified by foundries, helps RFIC designers to achieve first-pass silicon success. Its package extraction tool Metis enables fast package extraction for RF SiP. Its filter design tool XDS provides a complete flow from schematic, layout, to post-layout simulation to design IPD, SAW, and BAW filters. Xpeedic RF solution further enables RF front end miniaturization with the IPD designs from spec to volume production.
IRIS enables on-chip passive modeling and simulation for RFIC designs. With its accelerated 3D EM solver, advanced process support, and seamless Virtuoso integration, IRIS helps RFIC designers to achieve first-pass silicon success.
Metis provides fast package modeling and simulation for various package types. It supports System-in-Package (SiP) which is getting more and more adoption with the 5G RF front end being more modularized. It also supports IC-package co-simulation so that package impact can be captured.
The newly release XDS is a dedicated tool for RF filter designs. It provides a complete filter design flow from schematic to layout to post-layout co-simulation. It supports multiple filter types including IPD, SAW, and BAW. Built-in filter topology for quick schematic creation, built-in spec libraries, auto layout generation, tuning and optimization make filter designs easier.
Xpeedic advanced IPD technology to enable passive integration for 5G RF front end, helping customers to achieve faster design convergence from spec to volume production.
Xpeedic will also present at IMS MicroApps and Industry Workshop:
Click here to enter Xpeedic Virtual Booth.