Xpeedic co., LTD
LoginRegisterLanguage:中文English
  • Home
  • Products
    • EDA
      • HSD Solution
        • SnpExpert – S-parameter Exploration
        • ViaExpert – Via Modeling and Simulation
        • CableExpert – Cable Modeling & Simulation
        • TmlExpert – TML Modeling & Simulation
        • ChannelExpert – Channel Exploration
        • Heracles – Automated SI Signoff for High Speed Design
      • IC Solution
        • IRIS – RFIC Passive Extraction
        • IRIS Plus – Fast RFIC and MMIC Passive Extraction
        • iModeler – Passive PDK Model Generation
        • iVerifier – Passive PDK Verification
      • Package Solution
        • HERMES SI – Package and Board level signal integrity analysis
        • Metis – Fast Package and IC Co-simulation
      • RF Design Solution
        • XDS – Xpeedic RF System Design and Simulation Platform
      • Cloud Solution
        • LibManager – Library Management Platform
        • JobQueue – Simulation Job Queue System
    • IPD
      • Xpeedic IPD Applications
        • IPD in Mobile Phones
        • IPD for Wireless Connections
      • Xpeedic IPD Product List
    • SiP
  • Company
    • About US
    • Press Release
    • Xpeedic in the News
    • Events
    • Partners
    • Careers
  • Contact
  • Resources
  • Download
  • Free Trial
  • Search
Press Release
You are here: Home / Press Release / (中文) 芯和半导体与中芯宁波联合发布——首款国内自主开发高频体声波滤波器...
Banner-nsi

(中文) 芯和半导体与中芯宁波联合发布——首款国内自主开发高频体声波滤波器产品

2020-04-28/in Press Release /

Sorry, this entry is only available in 中文.

Share this entry
  • Share on Wechat
  • Share on Weibo
  • Share on Facebook
  • Share on Twitter
  • Share on Linkedin
  • Share by Mail

Latest News

  • Banner-B轮融资(中文) 国内EDA领导者芯和半导体完成最新一轮超亿元融资2021-01-12 - 10:01
  • Banner-10周年采访(中文) 芯和半导体：不做“Me too”的事 下一个十年做大国内EDA“拼图”2020-12-16 - 17:00
  • Banner-上海总部乔迁(中文) 国内EDA发展迎来高潮，芯和半导体总部乔迁升级2020-08-19 - 10:57

Latest Events

  • Banner-公开课12.17(中文) 公开课：芯和半导体解析5G射频芯片封装设计的最新解决方案2020-12-23 - 13:59
  • Banner-IPD培训(中文) 芯和受邀参与麦姆斯《射频前端核心技术》培训课程2020-12-17 - 14:00
  • Banner-ICCAD2020Xpeedic to Exhibit at ICCAD 20202020-12-17 - 13:59

Latest Resources

  • Banner_Metis_RDL(中文) 怎样实现封装与 RDL 层联合仿真2020-12-17 - 15:04
  • Banner_Channel_SI(中文) 高速串行链路后仿真流程2020-12-17 - 15:03
  • Banner_XDS_LNA(中文) 如何利用XDS仿真与设计射频前端LNA电路2020-12-17 - 15:02

Twitter

Linkedin

TAGS

3D IC 4G 5G EDA High Speed Huawei IC IMS IPD IPD RF RFIC SI simulation SiP SiP SMIC SOI 仿真，3D IC 射频，RFIC 射频，SI 系统级封装，RFIC

Contact US

Sales                                           Support
总部021-53391331(Tel)              021-53391331
0512 63989913(Fax)                   support@xpeedic.com

Copyright© 2010-2021 - Xpeedic co., LTD  沪ICP备19034605号
  • Home
  • Products
  • Company
  • Contact
  • Resources
  • Download
  • Free Trial
(中文) 芯和半导体EDA系列网络研讨会——怎样实现芯片与... Banner-Webinar_May Banner-TOD_DKDF (中文) TOD去嵌及快速Dk/Df提取
Scroll to top